 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| product structure silicon integrated circuit this product has no designed protection against radioactive ra ys . 1/ 36 tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.co.jp 25.dec.2015 rev.002 gate driver providing galvanic isolation series isolation voltage 2500vrms 1ch gate driver providing galvanic isolation bm60054 fv -c general description the bm60054 fv -c is a gate driver with isolation voltage 2500vrms, i/o delay time of 110ns, and a minimum input pulse width of 90ns. fault signal output function, ready signal output function, under voltage lockout (uvlo) function, short current protection (scp) function, and switching controller function are all built- in . features provid es galvanic isolation fault signal output function ready signal output function under voltage lockout function short circuit protection function soft turn-off function for short circuit protection (adjustable turn-off time) thermal protection function active miller clampi ng switching controller function output state feedback function ul 1577 recognized:file no. e356010 aec -q100 qualified (note 1) (note 1:grade1) applications driving igbt gate driving mosfet gate key specifications ? isolation voltage: 2500vrms ? maximum gate drive voltage: 20v(max) ? i/o delay time: 110ns(max) ? minimum input pulse width: 90ns(max) package w(typ) x d(typ) x h(max) ssop-b28w 9.2 mm x 10.4 mm x 2.4 mm typical application circuit figure 1. typical application circuit downloaded from: http:/// datashee t
2/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 contents general description ...................................................................................................................................................................... 1 features ......................................................................................................................................................................................... 1 applications .................................................................................................................................................................................. 1 key specifications ........................................................................................................................................................................ 1 package w(typ) x d(typ) x h(max) ....................................................................................................................................... 1 typical application circuit ........................................................................................................................................................... 1 contents ........................................................................................................................................................................................ 2 recommended range of external constant s3 pin configuration .......................................................................................................................................................................... 3 pin descrlptions ........................................................................................................................................................................... 3 absolute maximum ratings ......................................................................................................................................................... 4 recommended operating conditions ........................................................................................................................................ 4 insulation related characteristics .............................................................................................................................................. 4 electrical characteristics ............................................................................................................................................................. 5 electrical characteristics C continued ........................................................................................................................................ 6 typical performance curves ........................................................................................................................................................ 7 fig ure 3. main power supply circuit current 7 figure 4. output side circuit current(mode=h, vee2=0v, out1=l ) .7 fi gure 5. output side circuit current( mode=h, vee2=0v, out1=h). 7 figu re 6. fet_g on- resistance(source side/sink side)... 7 figure 7. oscillation frequency .... 8 figure 8. soft-start time ..... ... .8 figure 9. fb pin threshold voltage . ....8 figure 10. comp pin sink current ..... .. 8 figure 11. comp pin source current ................................. .... .9 figure 12 . over-current detection threshold .. ... .. 9 figure 13. logic input filtering time (l pulse).... ..9 figure 14. logic input filtering time (h pulse). .9 figure 15. ena input filtering time ...... ................................. 10 figure 16. mode input voltage h/l ... . 10 figure 17. out1h on-resistance (i out1 =40ma). .... . 10 figure 18. out1l on-resistance (i out1 =40ma) ... 10 figure 19. proout on-resistan ce (i proout =40ma) 11 figure 20. turn on time........11 figure 21. turn off time..........1 1 figure 22. out2 on-resistance (i out2 =40ma) ......1 1 figure 23 . short current detection threshold voltage .. ..12 figure 24 . desat leading edge blanking time .. ..12 figure 25 . short current detection filter time .. . . . .12 figure 26. short current detection delay time . . .. .1 2 figure 27 . scpin low voltage ... . ... 13 figure 28. output delay difference between proout and flt ..... . .1 3 figure 29 . thermal detection voltage .......1 3 application information .............................................................................................................................................................. 15 description of functions and examples of constant setting.. .. 16 selection of components externally connected ..................................................................................................................... 27 power dissipation ....................................................................................................................................................................... 27 thermal design ........................................................................................................................................................................... 27 i/o equivalence circuits ............................................................................................................................................................. 28 operational notes ... 32 ordering information 33 marking diagram. 33 physical dimension, tape and reel information ..................................................................................................................... 34 revision history ......................................................................................................................................................................... 35 downloaded from: http:/// 3/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 recommended range of external constants pin configuration pin descrlptions pin name symbol recommended value unit min typ max vreg c vreg 1.0 3.3 10.0 f vcc2 c vcc2 0.33 - - f rt r rt 24 68 150 k pin name pin function 1 vee2 output-side negative power supply pin 2 proout soft turn-off pin / gate voltage input pin 3 vtsin thermal detection pin 4 scpin short circuit current d et ection pin 5 nc no connection 6 gnd2 output-side ground pin 7 mode mode selection pin of output-side uvlo 8 uvloin output-side uvlo setting pin 9 vcc2 output-side positive power supply pin 10 nc no connection 11 out1h source side output pin 12 out1l sink side output pin 13 out2 output pin for miller clamp 14 vee2 output-side negative power supply pin 15 gnd1 input-side ground pin 16 flt fault output pin 17 ena input enabling signal pin 18 ina control input pin a 19 inb control input pin b 20 rdy ready output pin 21 rt switching frequency setting pin for switching controller 22 fb error amplifier inverting input pin for switching controller 23 comp error amplifier output pin for switching controller 24 v_batt main power supply pin 25 vreg input-side internal power supply pin 26 fet_g mos fet control pin for switching controller 27 sense current detection pin for switching controller 28 gnd1 input-side ground pin (top view) 8 gnd1 28 8 sense 27 8 fet_g 26 8 vreg 25 8 v_batt 24 8 comp 23 8 fb 22 8 rt 8 rdy 20 8 inb 19 9 21 8 ina 18 8 ena 17 8 flt 16 8 gnd1 15 vee2 1 proout 2 vtsin 3 scpin 4 nc 5 gnd2 6 mode 7 uvloin 8 vcc2 9 nc 10 out1h 11 out1l 12 out2 13 vee2 14 downloaded from: http:/// 4/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 ab solute maximum ratings (note 2) relative to gnd1 (note 3) relative to gnd2 (note 4) should not exceed pd and tj=150 ? c (note 5) derate above ta=25 ? c at a rate of 9.5mw/ ? c. mounted on a glass epoxy of 70 mm ? 70 mm ? 1.6 mm caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in ca se the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min max unit main power supply voltage (note 6) v batt 4.0 32 v output-side positive supply voltage (note 7) v cc2 10 20 v output-side negative supply voltage (note 7) v ee2 - 12 0 v maximum difference between output-side positive and negative voltages v max2 10 28 v switching frequency for switching controller f swr 100 500 khz (note 6) relative to gnd1 (note 7) relative to gnd2 insulation related characteristics (ul1577) parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol limit unit main power supply voltage v batt -0.3 to +40.0 (note 2) v output-side positive supply voltage v cc2 -0.3 to +24.0 (note 3) v output-side negative supply voltage v ee2 -15.0 to +0.3 (note 3) v maximum difference between output-side positive and negative v oltages v max2 30.0 v ina, inb, ena pin input voltage v in -0.3 to +7.0 (note 2) v mode pin input voltage v mode -0.3 to +vcc2+0.3 or + 24 .0 (note 3) v scpin pin input voltage v scpin -0.3 to +vcc2+0.3 or + 24 .0 (note 3) v vtsin pin input voltage v vts -0.3 to +vcc2+0.3 or + 24 .0 (note 3) v uvloin pin input voltage v uvloin -0.3 to +vcc2+0.3 or + 24 .0 (note 3) v out1h, out1l pin output current (peak 10 s) i out1peak 5.0 (note 4) a out2 pin output current (peak 10 s) i out2peak 5.0 (note 4) a proout pin output current (peak 10 s) i prooutpea 2.5 (note 4) a flt, rdy pin output current i flt 10 ma fet_g pin output current (peak 1 s) i fet_gpeak 1 a power dissipation pd 1.12 (note 5) w operating temperature range t opr - 40 to +125 c storage temperature range tstg - 55 to +150 c junction temperature tjmax +150 c downloaded from: http:/// 5/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 electrical characteristics (unless otherwise specified t a =- 40 c to +125c , v batt =4.0v to 32v, v cc2 =uvlo to 20v, v ee2 =- 12v to 0v ) parameter symbol min typ max unit conditions general main power supply circuit current 1 i batt1 1.1 1 .6 2.1 ma v_batt=4.0v main power supply circuit current 2 i batt2 0.8 1.3 1.8 ma v_batt=12.0v main power supply circuit current 3 i batt3 0.8 1. 3 1.8 ma v_batt=32.0v output side circuit current 1 i cc21 0.7 1.4 2.1 ma v cc2 =14v, out1=l output side circuit current 2 i cc22 0.4 1.1 1.8 ma v cc2 =14v, out1=h output side circuit current 3 i cc23 0.8 1.5 2.2 ma v cc2 =18v, out1=l output side circuit current 4 i cc24 0.8 1.2 1.9 ma v cc2 =18v, out1=h output side circuit current 5 i cc25 0.9 1.6 2.3 ma v cc2 =16v, v ee2 =-8v, out1=l output side circuit current 6 i cc26 0.6 1.3 2.0 ma v cc2 =16v, v ee2 =-8v, out1=h switching power supply controller fet_g output voltage h1 v fetgh1 3.8 4.0 4.2 v 4.2v 7/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 ul1577 ratings table following values are described in ul report. parameter values units conditions side 1 (input side) circuit current 1.3 ma v_batt=12 v, out1h/l =l side 2 (output side) circuit current 1.6 ma vcc2=18v, vee2=-6v, out1h/l =l side 1 (input side) consumption power 15.6 mw v_batt=12 v, out1h/l =l side 2 (output side) consumption power 38.4 mw vcc2=18v, vee2=-6v, out1h/l =l isolation voltage 2500 vrms maximum operating (ambient) temperature 125 maximum junction temperature 150 maximum strage temperature 150 maximum data transmission rate 5.5 mhz downloaded from: http:/// 8/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 typical performance curves figure 3. main power supply circuit current 0.8 1 1.2 1.4 1.6 1.8 2 4 11 18 25 32 v batt [v] i batt [ma] - 40 c 25 c 125 c 0 3 6 9 12 -40 0 40 80 120 ta [c] r ongh /rongl[] figure 6. fet_g on-resistance (source side/sink side) figure 4. output side circuit current (mode=h, vee2=0v, out1=l) figure 5. output side circuit current (mode=h, vee2=0v, out1=h) 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 10 15 20 v cc2 [v] i cc2 [ma] - 40 c 25 c 125 c 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 10 15 20 v cc2 [v] i cc2 [ma] - 40 c 25 c 125 c source side sink side downloaded from: http:/// 9/ 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 1.47 1.48 1.49 1.5 1.51 1.52 1.53 -40 0 40 80 120 ta [c] v fb [v] -160 -140 -120 -100 -80 -60 -40 -40 0 40 80 120 ta [c] i compsink [a] figure 10. comp pin sink current figure 7. oscillation frequency figure 9. fb pin threshold voltage figure 8. soft-start time 100 200 300 400 500 0 20 40 60 80 100 120 140 r rt [k] f sw [khz] 0 10 20 30 40 50 -40 0 40 80 120 ta [c] t ss [ms] downloaded from: http:/// 10 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 0.17 0.19 0.21 0.23 -40 0 40 80 120 ta [c] vocth[v] 40 60 80 100 120 140 160 -40 0 40 80 120 ta [c] i compsource [a] figure 11. comp pin source current figure 13. logic input filtering time (l pulse) figure 14. logic input filtering time (h pulse) figure 12. over-current detection threshold 0 25 50 75 -40 0 40 80 120 ta [c] t infil [ns] 0 25 50 75 4 11 18 25 32 ta [c] t infil [ns] downloaded from: http:/// 11 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 0 0.2 0.4 0.6 0.8 1 1.2 -40 0 40 80 120 ta [ ] r onh [] 8 8.2 8.4 8.6 8.8 9 -40 0 40 80 120 ta [ ] v modeh/l [v] 0 0.2 0.4 0.6 0.8 1 -40 0 40 80 120 ta [ ] t enafil [s] figure 15. ena input filtering time figure 17. out1h on-resistance (i out1 =40ma) fi gure 18. out1l on-resistance (i out1 =40ma) figure 16. mode input voltage h/l v modeh v model 0 0.2 0.4 0.6 0.8 1 1.2 -40 0 40 80 120 ta [ ] r onl [] downloaded from: http:/// 12 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 40 60 80 100 -40 0 40 80 120 ta [ ] t pona [ns] figure 20. turn on time figure 21. turn off time figure 19. proout on-resistance (i proout =40ma) 0.25 0.45 0.65 -40 0 40 80 120 ta [c] r onpro [ ] figure 22. out2 on-resistance (i out2 =40ma) 0.45 0.65 0.85 1.05 1.25 1.45 -40 0 40 80 120 ta [ ] r onpro [] 45 65 85 105 -40 0 40 80 120 ta [ ] t pona [ns] downloaded from: http:/// 13 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 0.26 0.32 0.38 0.44 0.5 -40 0 40 80 120 ta [c] t scppro [s] figure 25. short current detection filter time figure 24. desat leading edge blanking time 0.14 0.16 0.18 0.2 0.22 0.24 0.26 -40 0 40 80 120 ta [c] t desatleb [s] figure 23. short current detection voltage figure 26. short current detection delay time 0.12 0.16 0.2 0.24 0.28 -40 0 40 80 120 ta [c] t scpfil [ns] 0.47 0.48 0.49 0.5 0.51 0.52 0.53 -40 0 40 80 120 ta [c] v scdet [v] downloaded from: http:/// 14 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 1.61 1.65 1.69 1.73 1.77 -40 0 40 80 120 ta [c] v tsdet [v] figure 29. thermal detection voltage figure 28. output delay difference between proout and flt 0.1 0.3 0.5 0.7 -40 0 40 80 120 ta [c] t proflt [s] figure 27. scpin pin low voltage 0 0.05 0.1 0.15 0.2 -40 0 40 80 120 ta [c] v scpinl [v] downloaded from: http:/// 15 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 application information 1. description of pins and cautions on layout of board (1) v_batt (main power supply pin) this is the main power supply pin. connect a bypass capac itor betw een v_batt and gnd1 in order to suppress voltage variations. (2) gnd1 (input-side ground pin) the gnd1 pin is a ground pin on the input side. (3) vcc2 (output-side positive power supply pin) the vcc2 pin is a positive power supply pin on the output side. to reduce voltage fluctuations due to out1h/l pin output current and due to the driving current of the internal transformers, connect a bypass capacitor between vcc2 and gnd2 pins. (4) vee2 (output-side negative power supply pin) the vee2 pin is a power supply pin on the output si de. to suppress voltage fluctuations due to out1h/l pi n output current and due to the driving current of the internal transformers , connect a bypass capacitor between the vee2 and the gnd2 pins. connect the vee2 pin to the gnd2 pin when no negative power supply is used, (5) gnd2 (output-side ground pin) the gnd2 pin is a ground pin on the output side. connect the gnd2 pin t o the emitter / source of a power device. (6) ina,inb,ena (control input terminal) the ina,inb,ena are pins used to determine output logic. ena inb ina out1h out1l l x x hi -z l h h x hi -z l h l l hi -z l h l h h hi -z fault state(flt=l output) is released in rising of ena(l h). (7) flt (fault output pin) the flt pin is an open drain pin used to output a fault signal wh en short circuit protection function (scp) or thermal protection function is activated, and will be cleared at the ri sing edge of ena. status flt while in normal operation hi -z when a fault occurs (when scp or thermal protection is activated) l (8) rdy (ready output pin) the rdy pin shows the status of three internal protection fea tures which are v_batt uvlo, vcc2 uvlo, and output state feedback (osfb). the term output state feedback shows whether proout pin voltage (high or low) corresponds to input logic or not. status rdy while in normal operation hi -z v_batt uvlo or vcc2 uvlo or output state feedback l (9) mode (mode selection pin of output-side uvlo) the mode pin is a pin which selects internal threshold or external setting threshold for output-side uvlo. mode output-side uvlo threshold voltage l (=gnd2) setting by external. (use uvloin pin) h (=vcc2) fixed (=v uvlo2l ). (connect uvloin pin to vcc2 pin) (10) uvloin (output-side uvlo setting input pin) the uvloin pin is a pin for deciding uvlo setting value of vcc2. t he threshold value of uvlo can be set by dividing the resistance voltage of vcc2 and inputting su ch value. uvloin activates only at mode pin=l. when mode pin=h, connect uvloin pin to vcc2 pin. (11) out1h, out1l(output pin) the out1h pin is a source side pin used to drive the gate of a power device, and the out1l pin is a sink side pin used to drive the gate of a power device. downloaded from: http:/// 16 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (12) out2 (miller clamp pin) this is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to out1. it also functions as a pin for monitoring gate voltage for miller clamp and out2 pin voltage become not more than vout2on(typ 2.0v), miller clamp function operates. out2 should be connect to vee2 when miller clamp function is not used. (13) proout (soft turn-off pin) this is a pin for soft turn-off of output pin when short-cir cuit protection is in action. it also functions as a pin for monitoring gate voltage for output state feedback function. (14) scpin(short circuit current detection pin) the scpin pin is a pin used to detect current for short circuit prote ction. when the scpin pin voltage exceeds v scdet ,scp function will be activated. this may cause the ic to mal function in an open state. to avoid such trouble, short-circuit the scpin pin to the gnd2 pin when the short ci rcuit protection is not used. in order to prevent the wrong detection due to noise, the noise filter time t scpfil is set. (15) vtsin (thermal detection pin) the vtsin pin is a temperature sensor voltage input pin, w hich can be used for thermal protection of an output device. if vtsin pin voltage becomes v tsdet or less, out1h/l pin is set to hiz/l. ic may malfunction in the open status , so be sure to supply the vtspin more than v tsdet if the thermal protection function is not used. in order to prevent the wrong detection due to noise, the noise mask time t tsmsk is set. in addition, it can be used also as compulsi ve shutdown terminal other than a temperature sense by inputting a comparator output etc. (16) rt (switching frequency setting pin for switching controller) the rt pin is a pin used to make setting of switching frequency of switching controller. the switching frequency i s determined by the resistance value connected between rt and gnd1. the value of switching frequency is determined by the value of the resistor r rt. ? ? ) . r . /( khz f rt sw 4 8 10 22 10 37 1 ? ? ? ? ? ? ? (17) fb (error amplifier inverting input pin for switching controller) this is a voltage feedback pin of the switching controlle r. this pin combine with voltage monitoring at overvolta ge protection function and under voltage protection function fo r switching controller. when overvoltage or under voltage protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holding time (t dcdcrls ) is completed, the protection function will be released. under voltage function is not activated during soft-start. (18) comp (error amplifier output pin for switching controller) this is the gain control pin of the switching controller. conn ect a phase compensation capacitor and resist or . (19) vreg (input-side internal power supply pin) this is the input- si de internal power supply pin . be sure to connect a capacitor between vreg and gnd1 even when the switching controller is not used, in order to prevent os cillation and suppress voltage variation due to fet_g output current. (20) fet_g (mos fet control pin for switching controller) this is a mosfet control pin for the switching controller transformer d rive. (21) sense (connection to the current feedback resistor of the switching contro ller) this is a pin connected to the resist or of the switching controller current feedback. this pin combi nes with current monitoring at overcurrent protection function for switching co ntroller. when overcurrent protection is activated, switching controller will be at off state (fet_g pin outputs low). when the protection holdi ng time (t dcdcrls ) is completed, the over-current function will be released. downloaded from: http:/// 17 / 36 b m60054fv -c tsz02201 - 0818abh00080 -1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 2. description of functions and examples of constant setting (1) miller clamp function when out1=l and out 2 pin voltage < v out2on , internal mos of out2 pin is turned on and miller clamp functi on operates. in out2 pin input voltage out2 l not more than v out2on l h x hi -z fig ure 30. block diagram of miller clamp function figure 3 1 . timing chart of miller clamp function h l h l v ts det v sc det hi-z l h hi-z l v out2on out2 out1h/l flt scpin ina vtsin t pon t sto e na t sto v out2on out2 logic out1h/l vcc2 proout vee 2 - + predriver predriver predriver predriver gnd2 downloaded from: http:/// 18 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (2) under voltage lockout (uvlo ) function the bm60054 fv -c incorporates the under voltage lockout (uvlo) function on v_batt and vcc2. when the power supply voltage drops to the uvlo on voltage, the out1h/l pi n will output the "hi-z / l" and the flt pin will output the l signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. in addition, to pr event m is -triggers due to noise, mask time t uvlobattfil and t uvlo2fil are set on both voltage sides. figure 34. vcc2 uvlo function operation timing chart (mode=h) figure 33. vcc2 uvlo function operation timing chart (mode=l) figure 32. vbatt uvlo function operation timing chart i na h v_ b at t l v uv lo b a t t h v uv lo b a t t l r d y hi - z l out 1h/l h l f et _g h l i na h uvloi n l v uv lo i nh v uv lo i nl r d y hi - z l out 1h/l h l f et _g h l i na h vc c2 l v uv lo 2h v uv lo 2l r d y hi - z l out 1h/l h l f et _g h l downloaded from: http:/// 19 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (3) short circuit protection function (scp) when the scpin pin voltage exceeds v scdet , the scp function will be activated. when the scp function is activated, the out1h/l pin voltage will be set to the hi -z/hi-z level and the proout pin voltage will go to the l level first (soft turn-off ). next, after t sto has passed, out1h/l pin become hi-z/l (proout pin hold l). in a ddition, when out2 pin voltage < v out2on , miller clamp function operates. when the rising edge is put in the ena pin, the scp function will b e released. when out1h/l=hi-z/l or hi-z/hi-z, internal mosfet connected to scpin pin turns on to discharge c blank for desaturation protection function. when out1h/l=h/hi-z, internal mosfet conn ected to scpin pin turns off. v desat O r1 r2 r3 4.0v 15 k 39 k 4.7 k 4.5v 15 k 47 k 5.1 k 5.0v 15 k 51 k 5.1 k 5.5v 15 k 27 k 2.4 k 6.0v 15 k 33 k 2.7 k 6.5v 15 k 62 k 4.7 k 7.0v 15 k 47 k 3.3 k 7.5v 15 k 20 k 1.3 k 8.0v 15 k 82 k 5.1 k 8.5v 15 k 62 k 3.6 k 9.0v 15 k 33 k 1.8 k 9.5v 15 k 75 k 3.9 k 10.0v 15 k 68 k 3.3 k ? ? ? ? ? ? desatleb cc scdet blank blank scdet cc f scdet desat t v v r r r r c r r r r r r s t r r r r v v v v r r r v v v min d ? ? ? ? ? ? ? ? ? ? ? ?? ? ? ? ? ? ? ? ? ) 3 1 2 3 1ln( 3 1 2 3 1 2 3 1 2 3 3 2 3 2 outernal 2 1 downloaded from: http:/// 20 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 35 . block diagram of short circuit protection figure 36 . block diagram of desat scpfil logic v scdet vcc2 out1h/l proout scpin gnd2 flt gnd1 vee2 flt + - r1 r2 r3 d1 scpfil logic v scdet vcc2 out1h/l proout scpin gnd2 flt gnd1 vee2 flt + - downloaded from: http:/// 21 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 37 . scp operation timing chart flt proout scpin out1h/l in hi -z l hi -z l v scdet l hi -z h h l t sto t scpfil t scpro ena l h >t enafil >t enafil t sto t scpfil t scpro figure 38 . scp operation status transition diagram v scpin >v scdet yes no start out1h/l=hi-z / hi-z, proout=l, flt=l, out2=hiz out1h/l =h / hi-z, proout=hi-z , out2=hiz exceed filter time yes no ena=l h yes no in=h yes no no out1h/l= hi -z / l, proout=l, out2=l yes flt=hi-z exceed t sto out2 23 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 figure 40 . t hermal protection function operation timing chart figure 4 1. thermal protection function operation status transition diag ram flt proout vtsin out1h/l in hi -z l hi -z l v tsdet l hi -z h h l t sto t tsfil ena l h >t enafil >t enafil t sto t tsfil v tsin >v tsdet yes no start out1h/l=hi-z / hi-z, proout=l , flt=l, out2=hiz out1h/l =h / hi-z, proout=hi-z , out2=hiz exceed filter time yes no ena=l h yes no in=h yes no out2 25 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (d)the pin handling when not using switching controller when not using switching controller, please do pin handling as follows. pin no. pin name processing method 21 rt pull down in gnd1 by 68k 22 fb connect to vreg 23 comp connect to vreg 24 v_batt connect power supply 25 vreg connect capacitor 26 fet_g open 27 sense connect to vreg (6) gate state monitoring function when gate logic and input logic of output device moni tored with proout pin are compared, a logic l is output from rdy pin when they disaccord. in order to prevent the detection e rror due to delay of input and output, osfb filter time t osfbfil is provided. fet_g sense gnd1 comp v_batt vreg rt fb + - comp osc slope s r q uvlo_batt ovp uvp maxduty vreg + - v fb osc softstart oc v fb f ig ure 43 . the pin handling when not using switching controller downloaded from: http:/// 26 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (7) i/o condition table no. status input output v b a t t v c c 2 s c p i n v t s i n e n a i n b i n a o u t 2 p r o o u t o u t 1 h o u t 1 l o u t 2 p r o o u t f l t r d y 1 scp h h h l h h x hi -z hi -z hi -z l l hi -z 2 h h h l h l x hi -z hi -z l l l hi -z 3 uvlo_vbatt uvlo l h x x x h h hi -z l hi -z hi -z hi -z l 4 uvlo l h x x x l l hi -z l l hi -z hi -z l 5 uvlo_vcc2 uvlo l h x x x h h hi -z l hi -z hi -z hi -z l 6 uv lo l h x x x l l hi -z l l hi -z hi -z l 7 thermal protection l l x x x h x hi -z hi -z hi -z l l hi -z 8 l l x x x l x hi -z hi -z l l l hi -z 9 disable l h l x x h h hi -z l hi -z hi -z hi -z l 10 l h l x x l l hi -z l l hi -z hi -z hi -z 11 inb active l h h h x h h hi -z l hi -z hi -z hi -z l 12 l h h h x l l hi -z l l hi -z hi -z hi -z 13 normal operation l input l h h l l h h hi -z l hi -z hi -z hi -z l 14 l h h l l l l hi -z l l hi -z hi -z hi -z 15 normal operation h input l h h l h h h h hi -z hi -z hi -z hi -z hi -z 16 l h h l h l l h hi -z hi -z hi -z hi -z l : > uvlo, x:don't care downloaded from: http:/// 27 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 (8) power supply startup / shutoff sequence figure 44. power supply startup / shutoff sequence out1h/l proout rdy v_batt vcc2 vee2 in h l h l hi -z l hi -z l hi -z v uvlo2h v uvlobattl v uvlo2h v uvlobatt l v uvlo2h v uvlobattl 0v 0v 0v out2 l hi -z out1h/l proout rdy v_batt vcc2 vee2 in h l h l hi -z l hi -z l hi -z v uvlo2h v uvlobattl v uvlo2l v uvlobatth v uv lo2l v uvlobatth 0v 0v 0v out2 l hi -z out1h/l proout rdy v_batt vcc2 vee2 in h l h l hi -z l hi -z l hi -z v uvlo2h v uvlobattl v uvlo2h v uvlobattl v uvlo2l v uvlobatth 0v 0v 0v out2 l hi -z out1h/l proout rdy v_batt vcc2 vee2 in h l h l hi -z l hi -z l hi -z v uvlo2l v uvlobatth v uvlo2l v uvlobatth v uvlo2l v uvlobatth 0v 0v 0v out2 l hi -z : since the vcc2 to vee2 pin voltage is low and the output mos does no t turn on, the output pins become hi-z conditions. : since the vcc1 to gnd1 pin voltage is low and the rdy output mos does not turn on, the output pins become hi -z conditions. downloaded from: http:/// 28 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 selection of components externally connected figure 45. recommended external parts power dissipation thermal design please make sure that the ic s chip temperature tj is not over 150 c , while considering the ic s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded, the ic may malfunctions or some problems (ex. abnormal operation of various parasitic elements and increasing of leak current) may occur. constant use under th ese circumstances leads to deterioration and eventually ic may destruct. tjmax=150 c must be strictly obeyed under all circumstances. figure 46. ssop-b28w derating curve 0 0.25 0.5 0.75 1 1.25 1.5 0 25 50 75 100 125 150 175 ambient temperature : ta [ ] power dissiqation : pd [w] measurement machine : th156 (kuwano electric) measurement condition : rohm board board size : 114.3 76.2 1.6mm 3 1-layer board : ja=111.1 c /w recommended rohm mcr03ezp recommended rohm mcr03ezp recommended sumida ceer117 recommended rohm rb168m150 recommended rohm ltr18ezp recommended rohm mcr100jzh ltr50uzp recommended rohm mcr100jzh ltr50uzp recommended rohm rsr025n05 downloaded from: http:/// 29 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 i/o equivalence circuits pin no. pin name input output equivalent circuit diagram pi n function 2 proout soft turn-off pin / gate voltage input pin 3 vtsin thermal detection pin 4 scpin schort circuit current detection pin 7 mode mode selection pin of output-side uvlo 8 uvloin output-side uvlo setting pin vcc2 vee2 gnd2 uvloin vcc2 mode vee2 gnd2 vcc2 vtsin gnd2 vcc2 proout vee2 vcc2 scpin gnd2 downloaded from: http:/// 30 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 11 out1h source side output pin 12 out1l sink side output pin 13 out2 output pin for miller clamp 16 flt fault output pin 20 rdy ready output pin 17 ena input enabling signal pin out1l vee2 vcc2 out1h out2 vee2 vcc2 vreg gnd1 ena flt rdy gnd1 downloaded from: http:/// 31 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 18 ina control input pin a 19 inb control input pin b 21 rt switching frequency setting pin for switching controller 22 fb error amplifier inverting input pin for switching controller rt v_batt vee2 gnd1 fb v_batt internal power supply vreg gnd1 inb vreg gnd1 ina downloaded from: http:/// 32 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 pin no. pin name input output equivalent circuit diagram pin function 23 comp error amplifier output pin for switching controller 25 vreg input -side internal power supply pin 26 fet_g mos fet control pin for switching controller 27 sense current detection pin for switching controller gnd1 comp internal power supply v_batt gnd1 fet_g vreg v_batt internal power supply v_batt gnd1 sense internal power supply downloaded from: http:/// 33 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 operational notes 1. reverse connection of power supply design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and sup ply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and sup ply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tra ces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the gro und traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thic k as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxim um rating of the pd stated in this specification is when th e ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board . in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may fl ow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power su pply. therefore, give special consideration to power coupling cap acitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a c apacitor directly to a low-impedance output pin may sub ject the ic to stress. always discharge capacitors completely after each p rocess or step. the ics power supply should a lways be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly a nd use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) a nd unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electri c field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significa nt effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified , unused input terminals should be connected to the po wer supply or ground line. downloaded from: http:/// 34 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 operational notes C continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them iso lated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. t he operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 47. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectri c constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. ordering information b m 6 0 0 5 4 f v - c e 2 part number package fv: ssop-b28w rank c:automotive packaging and forming specification e2: embossed tape and reel marking diagram n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements ssop-b28w (top view) b m 6 0 0 5 4 part number marking lot number 1pin mark downloaded from: http:/// 35 / 36 BM60054FV-C tsz02201-0818abh00080-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 physical dimension, tape and reel information package name ssop-b28w (max 9.55 (include.burr)) downloaded from: http:/// 36 / 36 b m60054fv -c tsz02201 - 0818abh00080 -1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.co .jp tsz22111 ? 15 ? 001 25.dec.2015 rev.002 revision history date revision changes 10 . apr.201 5 00 1 new release 25.dec.2015 002 page 7 adding ul1577 rating table page15 misprint correction of description of pins and cautions on layout of board (7)flt page17 misprint correction of description of functions and examples of constant setting (1) miller clamp function downloaded from: http:/// notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:/// notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:/// datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:/// |
Price & Availability of BM60054FV-C
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |